View IP5306CX8_3783969.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. product profile 1.1 general description the IP5306CX8 is a dual-channel rc low-pass filter array which is designed to provide filtering of undesired rf signals. in addi tion, the IP5306CX8 incorporates diodes to provide protection to downstream compon ents from electrostatic discharge (esd) voltages as high as 15 kv contact according the iec 61000-4-2 model, far exceeding standard level 4. IP5306CX8 is fabricated using monolithi c silicon technology and integrates five resistors, several diodes and four high density capacitors in a single wafer-level chip-scale package (wlcsp). these features make the IP5306CX8 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 features and benefits ? pb-free, rohs compliant and free of ha logen and antimony (dark green compliant) ? integrated differential microphone rc filter with high density capacitors [2 (0.8 nf + 1.5 nf)] and biasing resistor network ? integrated esd protection withstanding 15 kv contact discharge, far exceeding iec 61000-4-2 level 4 ? wlcsp with 0.4 mm pitch 1.3 applications ? differential microphones in mobile phones and other portable electronics IP5306CX8 integrated differential microp hone filter with esd protection to iec 61000-4-2 level 4 rev. 01 ? 12 february 2010 product data sheet
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 2 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 2. pinning information 2.1 pinning 2.2 pin description 3. ordering information fig 1. pin configuration IP5306CX8 008aaa206 transparent top view, solder balls facing down a 23 1 b c bump a1 index area table 1. pinning pin description a1 not connected (missing ball) a2 filter channel feedthrough (e.g. hookup) a3 microphone biasing supply pin b1 filter channel 1 external 15 kv microphone connection b2 ground b3 filter channel 1 internal 2 kv microphone amplifier/analog-to-digital converter (adc) input connection c1 filter channel 2 external 15 kv microphone connection c2 ground c3 filter channel 2 internal 2 kv microphone amplifier/adc input connection table 2. ordering information type number package name description version IP5306CX8 wlcsp8 wafer level chip-size package; 8 bumps; 1.19 1.19 0.61 mm IP5306CX8
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 3 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 4. functional diagram 5. limiting values [1] device is qualified with 1000 pulses of 15 kv contact discharges each, according to the iec61000-4-2 model and far exceeds the specified level 4 (8 kv contact discharge). fig 2. schematic diagram IP5306CX8 008aaa19 4 sub sub sub sub sub b1 a2 c2 c1 b3 c3 a3 c 1 b2 c 2 r pd r pu r s r s(ch) r s(ch) 2 k 1.5 nf 25 2.2 k 0.8 nf 2.2 k 1 k c 1 c 2 1.5 nf 0.8 nf table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage ? 0.5 +4.5 v v esd electrostatic discharge voltage pins b1 and c1 to ground contact discharge [1] ? 15 +15 kv air discharge [1] ? 15 +15 kv iec 61000-4-2 level 4; pins b1 and c1 to ground contact discharge ? 8 +8 kv air discharge ? 15 +15 kv iec 61000-4-2 level 1; pins a2, a3, b3 and c3 to ground contact discharge ? 2 +2 kv air discharge ? 2 +2 kv p ch channel power dissipation continuous power - 30 mw p tot total power dissipation continuous power - 60 mw t stg storage temperature ? 55 +150 c t reflow(peak) peak reflow temperature 10 s maximum - 260 c t amb ambient temperature ? 35 +85 c
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 4 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 6. characteristics [1] guaranteed by design. table 4. channel characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit r pu pull-up resistance biasing 1.9 2.0 2.1 k r pd pull-down resistance biasing 0.8 1.0 1.2 k r s(ch) channel series resistance 1.76 2.20 2.64 k r s series resistance 20 25 30 c 1 capacitance 1 high density; v bias(dc) = 0 v; f = 100 khz - 0.8 1.0 nf c 2 capacitance 2 1.0 1.5 - nf c d diode capacitance v bias(dc) = 0 v; f = 100 khz [1] connected to 15 kv esd pins - 11.5 - pf connected to 2 kv esd pins - 3 - pf v br breakdown voltage positive direction; i test = 1 ma 14 16.5 - v negative direction; i test = ? 1 ma - ? 16.5 ? 14 v i lr reverse leakage current per channel; v i = 5.0 v - - 100 na per channel; v i = ? 5.0 v ? 100 - - na
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 5 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 7. application information 7.1 application diagram a typical application diagram showing ip53 06cx8 connected between a microphone and the baseband adc input pins is depicted in figure 3 . the 2 kv esd compliant pins (a2, a3, b3 and c3) are connected to the baseband interface side while the two 15 kv esd compliant pins (b1 and c1) are connected to the microphone. fig 3. typical application diagram of IP5306CX8 001aal18 7 IP5306CX8 sub sub baseband sub sub sub b1 a2 hook detect c2 c1 b3 c3 a3 c 1 c 1 b2 c 2 microphone bias microphone amplifier c 2 r pd r pu r s r s(ch) dc-decoupling capacitor dc-decoupling capacitor r s(ch) adc
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 6 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 7.2 insertion loss the insertion loss measurement configuration of a typical 50 network analyzer (nwa) system for evaluation of the IP5306CX8 is shown in figure 4 . the insertion loss of both microphone channels at frequencies up to 6 ghz is displayed in figure 5 . pin a3 (microphone biasing supply pin) is shorted to ground, pin a2 (filter channel feedthrough) is left floating (n.c.). fig 4. frequency response measurement configuration (1) channel 1 (pins b1 and b3). (2) channel 2 (pins c1 and c3). fig 5. measured insertion loss magnitudes out 001aai75 5 50 50 v gen dut in test board f (mhz) 10 ? 2 10 4 10 3 10 2 10 ? 1 10 1 001aal188 ? 50 ? 70 ? 30 ? 10 s 21 (db) ? 90 (1) (2)
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 7 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 7.3 crosstalk the crosstalk measurement configuration of a typical 50 nwa system for evaluation of the IP5306CX8 is shown in figure 6 . the measured crosstalk within the IP5306CX8 in a 50 nwa system from one channel to the other channel is shown in figure 7 . pin a3 (microphone biasing supply pin) is shorted to ground, pin a2 (filter channel feedthrou gh) is left floating (n.c.). fig 6. crosstalk measurement configuration (1) channel 1 to channel 2 (pins b1 and c3). (2) channel 2 to channel 1 (pins c1 and b3). fig 7. measured crosstalk between adjacent channels out_2 001aai75 6 50 50 v gen dut in_1 out_1 in_2 test board 50 50 001aal189 ? 50 ? 70 ? 30 ? 10 ct (db) ? 90 f (mhz) 10 ? 1 10 4 10 3 110 2 10 (1) (2)
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 8 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 7.4 voltage dependency of high density capacitors the high density capacitors integrated in IP5306CX8 show a voltage dependency similar to some higher value discrete ceramic capacitors. when used in an average mobile application, the typical voltage swing across the capacitance will be in the range of ? 0.5 v to +4 v. in this event, the capacitor values change proportional to the bias voltage as depicted in figure 8 . the measurement is performed several times, starting at the ?starting point? at 0 v, increasing to 4 v (arrow 1), decreasing to ? 0.5 v (following arrow 2) and back to +4 v (arrow 3). when measuring the capacitance over voltage for voltage swings of e.g. ? 20 v to +20 v, a hysteresis in the capacitance over v bias(dc) can be observed (see figure 9 ), which is inherent to the integration process for the high density capacitors in this product. again, the measurement starts at ?starting point?, following arrow 1 up to v bias(dc) = 20 v, from there along arrow 2 down to v bias(dc) = ? 20 v and back via arrow 3 and arrow 4. values of c 1 and c 2 specified in ta b l e 4 are based on measurements at the starting point. fig 8. relative capacitance c/c (0v) of high density capacitors for ? 0.5 v v bias(dc) +4 v fig 9. relative capacitance c/c (0v) of high density capacitors for ? 20 v v bias(dc) +20 v v bias(dc) (v) ? 0.5 4.5 3.5 1.5 2.5 0.5 001aak632 0.95 0.85 1.05 1.15 c/c (0v) 0.75 starting point 2 1 3 v bias(dc) (v) ? 20 20 10 ? 10 0 001aak633 0.5 0.75 0.25 1 1.25 c/c (0v) 0 starting point 2 1 4 3
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 9 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 8. package outline fig 10. package outline IP5306CX8 (wlcsp8) wlcsp8_3x3-a1_po european projection w lcsp8: wafer level chip-size package; 8 bumps (3 x 3 - a1) bump a1 index area d e detail x a a 2 a 1 e 1 e 1 e e b 1 c b a 23 x table 5. dimensions for figure 10 symbol min typ max unit a 0.56 0.61 0.66 mm a 1 0.18 0.20 0.22 mm a 2 0.38 0.41 0.44 mm b 0.21 0.26 0.31 mm d 1.14 1.19 1.24 mm e 1.14 1.19 1.24 mm e - 0.4 - mm e 1 - 0.8 - mm
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 10 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 9. soldering of wlcsp packages 9.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 9.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 9.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 11 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 6 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 11 . table 6. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2 000 > 2 000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 11 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 9.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 9.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 9.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 11. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 12 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 9.3.4 cleaning cleaning can be done after reflow soldering. 10. abbreviations 11. revision history table 7. abbreviations acronym description adc analog-to-digital converter dut device under test esd electrostatic discharge nwa network analyzer rohs restriction of hazardous substances wlcsp wafer-level chip-scale package table 8. revision history document id release date data sheet status change notice supersedes IP5306CX8_1 20100212 product data sheet - -
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 13 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer?s third party customer(s) (hereinafter both referred to as ?application?). it is customer?s sole responsibility to check whether the nxp semiconductors product is suitable and fit for the application planned. customer has to do all necessary testing for the application in order to avoid a default of the application and the product. nxp semiconducto rs does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. non-automotive qualified products ? unless the data sheet of an nxp semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive sp ecifications and standards, customer (a) shall use the product without nx p semiconductors? warranty of the document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
IP5306CX8_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 12 february 2010 14 of 15 nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive appl ications beyond nxp semiconductors? standard warranty and nxp semicond uctors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP5306CX8 integrated differential microphone filter with esd protection ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 february 2010 document identifier: IP5306CX8_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 5 7.1 application diagram . . . . . . . . . . . . . . . . . . . . . 5 7.2 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3 crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.4 voltage dependency of high density capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 soldering of wlcsp packages. . . . . . . . . . . . 10 9.1 introduction to soldering wlcsp packages . . 10 9.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 10 9.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 10 9.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 11 9.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 contact information. . . . . . . . . . . . . . . . . . . . . 14 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

▲Up To Search▲

Price & Availability of IP5306CX8

	To Download IP5306CX8 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .